For Exceptionally Low Thermal Resistance The Tpcm HP105 Series is a high-performance phase change material (PCM) product with exceptionally low thermal resistance. It has a softening range of approximately 50deg C to 60deg C. Proprietary technology prevents excessive pump-out after the initial heat cycle. The material is naturally tacky and requires no adhesive coating or heat sink preheat for attachment. The Tpcm HP105 Series does not cure and can be easily removed without pulling the processor out of the socket. It is supplied in rolls with a top tabbed liner for easy manual or large volume automated applications.
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| Consumer | Telecom/Datacom |
| Automated Packaging | Automated Pad Placement |
| Custom Automation | Custom Product Development |
| Modeling | Prototyping |
| Service | Testing |
| Graphic Cards | Hard Disk Drives |
| IGBTs | Memory Modules |
| Notebooks/Tablets/Portable Devices | Servers |
| Smart Home Devices | Wireless infrastructure |
| Color | White |
| Density (g/cc) | 1.30 |
| Operating Temperature Max (Celsius) | 125 |
| Operating Temperature Min (Celsius) | -25 |
| Phase Change Temperature (Deg C) | 50 |
| Shelf Life | 1 year from Date of Shipment |
| Thermal Conductivity (W/mK) | 0.73 |
| Thermal Resistance @50 psi Max (C-in2/W) | 0.017 |
| Thermal Resistance @50 psi Min (C-in2/W) | 0.017 |
| Thickness Max (inches) | 0.005 |
| Thickness Max (mm) | 0.13 |
| Thickness Min (inches) | 0.005 |
| Thickness Min (mm) | 0.13 |
| Volume Resistivity | 3.00 x10^14 Ohm-cm |
