Tpcm FSF52 is a free standing film. It contains no substrate. At temperatures greater than 52?C Tpcm FSF52 changes into a molten state and under low closure force wets the heat sink and component surfaces to create a very thin low thermal resistance interface. Tpcm FSF52 is thixotropic and won't flow from the interface.
Tpcm FSF-52 has superior thermal performance comparable to the highest performing grease and phase change products available. Since it is a free standing film it is easy to handle and is a great replacement for messy grease.
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| Consumer | Telecom/Datacom |
| Automated Packaging | Automated Pad Placement |
| Custom Automation | Custom Product Development |
| Modeling | Prototyping |
| Service | Testing |
| Graphic Cards | Hard Disk Drives |
| IGBTs | Memory Modules |
| Notebooks/Tablets/Portable Devices | Servers |
| Smart Home Devices | Wireless infrastructure |
| Color | White |
| Density (g/cc) | 2.10 |
| Dielectric Constant | 6.70 |
| Minimum Bondline Thickness (microns) | 12 |
| Minimum Bondline Thickness (mm) | 0.01 |
| Operating Temperature Max (Celsius) | 125 |
| Operating Temperature Min (Celsius) | -40 |
| Phase Change Temperature (Deg C) | 52 |
| Shelf Life | 1 year from Date of Shipment |
| Thermal Conductivity (W/mK) | 0.90 |
| Thermal Resistance @10 psi Max (C-in2/W) | 0.042 |
| Thermal Resistance @10 psi Min (C-in2/W) | 0.042 |
| Thermal Resistance @50 psi Max (C-in2/W) | 0.030 |
| Thermal Resistance @50 psi Min (C-in2/W) | 0.030 |
| Thickness Max (inches) | 0.005 |
| Thickness Max (mm) | 0.13 |
| Thickness Min (inches) | 0.005 |
| Thickness Min (mm) | 0.13 |
| UL Flammability Rating | V-0 |
| Volume Resistivity | 8.00 x10^13 Ohm-cm |
