Product Description
Tpcm 780SP is a high performance, inherently tacky, easy to rework screen printable phase change thermal interface material. Developed specifically to meet the high thermal conductivity and low thermal resistance requirements of today'ss demanding processors. This silicone-free material is so soft that it begins to flow as the temperature is elevated by just a small amount.
Features and Benefits
- Silicone-free for applications that are silicone sensitive Low total thermal resistance
- Inherently tacky and easy to use, no adhesive required
- High thermal reliability
- Ease of use for high volume manufacturing
- No mess due to thixotropic characteristics which prevent flow outside of interface
