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Tpcm 780

Thermal Phase Change Material

Product Description

Tpcm 780 is a high performance, inherently tacky, easy to rework phase change thermal interface material. Developed specifically to meet the high thermal conductivity and low thermal resistance requirements of today’s demanding processors. This silicone-free material is so soft that it begins to flow as the temperature is elevated by just a small amount. Also, since no tabs are required, Tpcm 780 eliminates the need for expensive converting.

Features and Benefits
  • Silicone-free for applications that are silicone sensitive
  • Outstanding thermal performance helps to ensure CPU/application reliability
  • No mess due to thixotropic characteristics which prevent flow outside of interface


Automated PackagingAutomated Pad Placement
Custom AutomationCustom Product Development

Graphic CardsHard Disk Drives
IGBTsMemory Modules
Notebooks/Tablets/Portable DevicesServers
Smart Home DevicesWireless infrastructure

Technical Specification

Density (g/cc)2.50
Hardness (Shore 00)85
Minimum Bondline Thickness (microns)25
Minimum Bondline Thickness (mm)0.03
Operating Temperature Max (Celsius)125
Operating Temperature Min (Celsius)-40
Outgassing CVCM (%)0.400
Outgassing TML (%)0.510
Phase Change Temperature (Deg C)45
Shelf Life1 year from Date of Shipment
Thermal Conductivity (W/mK)5.40
UL Flammability RatingV-0

Company Address

Techni3 Ltd

Unit 4B Caerphilly Business Park


CF83 3GS

+44 (0)29 2125 2100

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