TpcmTM 200SP is a silicone free, thermal phase change material (PCM) designed to meet the thermal reliability and outgassing requirements of LED lighting applications, while offering a low total cost of ownership. It is specifically designed for use in various optical applications such as automotive headlamps, LED lighting, cameras, lasers and sensors. TpcmTM 200SP is also well suited for the broader market where the thermal requirements are moderately demanding. Tpcm 200SP is a screen printable phase change material which quickly dries to the touch so that it can be pre-applied to components for future assembly.
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| Consumer | Telecom/Datacom |
| Automated Packaging | Automated Pad Placement |
| Custom Automation | Custom Product Development |
| Modeling | Prototyping |
| Service | Testing |
| Graphic Cards | Hard Disk Drives |
| IGBTs | Memory Modules |
| Notebooks/Tablets/Portable Devices | Servers |
| Smart Home Devices | Wireless infrastructure |
| Color | White |
| Density (g/cc) | 3.20 |
| Minimum Bondline Thickness (microns) | 10 |
| Minimum Bondline Thickness (mm) | 0.01 |
| Operating Temperature Max (Celsius) | 125 |
| Operating Temperature Min (Celsius) | -40 |
| Phase Change Temperature (Deg C) | 45 |
| Shelf Life | 1 year from Date of Shipment |
| Thermal Conductivity (W/mK) | 1.50 |
| Thermal Resistance @10 psi Max (C-in2/W) | 0.070 |
| Thermal Resistance @10 psi Min (C-in2/W) | 0.070 |
| Thermal Resistance @30 psi Max (C-in2/W) | 0.048 |
| Thermal Resistance @30 psi Min (C-in2/W) | 0.048 |
| Thermal Resistance @50 psi Max (C-in2/W) | 0.027 |
| Thermal Resistance @50 psi Min (C-in2/W) | 0.027 |
| UL Flammability Rating | V-0 |
| Viscosity (cP) | 20000 |
| Part Number | Part Name | Thermal Resistance @ 10 psi(C - in2 / W) | Thermal Resistance @ 50 psi(C - in2 / W) | Minimum Bondline Thickness (microns) |
|---|---|---|---|---|
| A17064-00 | Tpcm 200SP 1kg,Can, | 0.07 | 0.03 | 10 |
