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Tpcm 200SP

Screen Printable Phase Change Material

Product Description

TpcmTM 200SP is a silicone free, thermal phase change material (PCM) designed to meet the thermal reliability and outgassing requirements of LED lighting applications, while offering a low total cost of ownership. It is specifically designed for use in various optical applications such as automotive headlamps, LED lighting, cameras, lasers and sensors. TpcmTM 200SP is also well suited for the broader market where the thermal requirements are moderately demanding. Tpcm 200SP is a screen printable phase change material which quickly dries to the touch so that it can be pre-applied to components for future assembly.

Features and Benefits
  • Silicone-free
  • Low thermal resistance
  • Ease of use for high volume manufacturing
  • High thixotropic index
  • Re-flow compatible
  • High thermal reliability, minimal pump out


Automated PackagingAutomated Pad Placement
Custom AutomationCustom Product Development

Graphic CardsHard Disk Drives
IGBTsMemory Modules
Notebooks/Tablets/Portable DevicesServers
Smart Home DevicesWireless infrastructure

Technical Specification

Density (g/cc)3.20
Minimum Bondline Thickness (microns)10
Minimum Bondline Thickness (mm)0.01
Operating Temperature Max (Celsius)125
Operating Temperature Min (Celsius)-40
Phase Change Temperature (Deg C)45
Shelf Life1 year from Date of Shipment
Thermal Conductivity (W/mK)1.50
Thermal Resistance @10 psi Max (C-in2/W)0.070
Thermal Resistance @10 psi Min (C-in2/W)0.070
Thermal Resistance @30 psi Max (C-in2/W)0.048
Thermal Resistance @30 psi Min (C-in2/W)0.048
Thermal Resistance @50 psi Max (C-in2/W)0.027
Thermal Resistance @50 psi Min (C-in2/W)0.027
UL Flammability RatingV-0
Viscosity (cP)20000
Parts (1)
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Part NumberPart NameThermal Resistance @ 10 psi(C - in2 / W)Thermal Resistance @ 50 psi(C - in2 / W)Minimum Bondline Thickness (microns)
A17064-00Tpcm 200SP 1kg,Can,0.070.0310

Company Address

Techni3 Ltd

Unit 4B Caerphilly Business Park


CF83 3GS

+44 (0)29 2125 2100

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