Environmentally Friendly Thermally Conductive Grease Tgrease 880 is a silicone based, high performance thermal grease designed to meet the thermal, reliability and price requirements of high end CPUs, GPUs and custom ASICS chips. With superior wetting properties to comparable grease, Tgrease 880 fills the microscopic irregularities of the components it contacts, resulting in very low thermal resistance. Tgrease 880 is stable and does not dry out, settle or harden. A full reliability study can be provided upon request. Tgrease 880 meets all environmental requirements including RoHS. Tgrease 880 is supplied in half kilogram, one kilogram and three kilogram containers.
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| Automotive | Industrial |
| Automated Packaging | Automated Pad Placement |
| Custom Automation | Custom Product Development |
| Modeling | Prototyping |
| Service | Testing |
| Graphic Cards | Hard Disk Drives |
| IGBTs | Memory Modules |
| Notebooks/Tablets/Portable Devices | Servers |
| Smart Home Devices | Wireless infrastructure |
| Color | Grey |
| Density (g/cc) | 2.70 |
| Minimum Bondline Thickness (microns) | 25 |
| Minimum Bondline Thickness (mm) | 0.03 |
| Operating Temperature Max (Celsius) | 150 |
| Operating Temperature Min (Celsius) | -40 |
| Outgassing CVCM (%) | 0.150 |
| Outgassing TML (%) | 0.070 |
| Shelf Life | 2 years from date of mix |
| Thermal Conductivity (W/mK) | 3.00 |
| Thermal Resistance @10 psi Max (C-in2/W) | 0.014 |
| Thermal Resistance @10 psi Min (C-in2/W) | 0.014 |
| Thermal Resistance @30 psi Max (C-in2/W) | 0.011 |
| Thermal Resistance @30 psi Min (C-in2/W) | 0.011 |
| Thermal Resistance @50 psi Max (C-in2/W) | 0.009 |
| Thermal Resistance @50 psi Min (C-in2/W) | 0.009 |
| UL Flammability Rating | V-0 |
| Viscosity (cP) | 1500 |
