Tflex B200

Silicone based Thermal Gap Filler

Product Description

Tflex B200 is a reliable, compliant thermal interface material offering good thermal performance and easier handling and features a range of multiple surface and enforcement options for a variety of applications. This gap fillers low modulus interface and softness relieves mechanical stress. It properly fills gaps, with tolerance to reduce thermal resistance. Tflex B200 helps absorb shock, resulting in improved device reliability over the long term. It has high dielectric insulation which works to protect against dielectric breakdown in or between devices. Tflex B200 as a standard product is naturally tacky on both sides and requires no additional adhesive coating to inhibit thermal performance. The tack is designed to hold the pad in place during assembly and transport. Tflex B200MFG, an option featuring fiberglass in the middle, has strong tensile and both sides exhibit tackiness properties. This helps prevent deforming during manual or automated assembly. Tflex B200FG, a second option, has fiberglass enforcement located near one side. It offers a side difference, a higher deflection than the B200MFG option, and provides protection close to one side.