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Soft HT-SMD Foam Contact

Soft HT-SMD Foam Contact Solutions

Product Description

Laird’s SMD (Surface Mount Device) Grounding Contact is a foam-cored contact with a metalized polyimide film outer covering. It is used for circuit grounding of SMT (Surface Mount Technology) devices. These contacts are designed to be solder-reflow compatible, and are suitable for automatic processing.

Features and Benefits
  • Sn/Cu Plated PI Film outer layer
  • Silicon Foam Core
  • Soft SMD contacts are RoHS compliant
  • Halogen-free per IEC-61249-2-21 standard
  • Reflow-tunnel compatible to 260° C

5G HandsetAutomotive
Commercial TelecomComputing
HandsetIndustrial Electronics
TabletsTelecom, 5G, Consumer, Automotive, Military

Automated PackagingCustom Automation
Custom Product DevelopmentPrototyping

Antenna ContactConducting on PCB
Grounding on PCB

Datasheets and Documents

Technical Specification

Compression Set<20%
Construction and CompositionMetallized PI film over Silicone Foam
Flame RetardancyUL94 V1
Foam Core MaterialSilicone
Gasket ProfileRectangular
Operating Temperature Max (Celsius)125
Operating Temperature Min (Celsius)-40
Parts (2)
↑ click on headings to sort ↓
Part NumberPart NameCompression SetConstruction and CompositionOperating Temperature Max (Celsius)Operating Temperature Min (Celsius)
SLM<20%Metallized PI film over Silicone Foam125-40
SSM<20%Metallized PI film over Silicone Foam125-40

Company Address

Techni3 Ltd

Unit 4B Caerphilly Business Park


CF83 3GS

+44 (0)29 2125 2100

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