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Soft HB-SMD Foam Contact

Soft HB-SMD Foam Contact Solutions

Product Description

Laird’s SMD (Surface Mount Device) Grounding Contact is a foam-cored contact with a metalized polyimide film outer covering. It is used for circuit grounding of SMT (Surface Mount Technology) devices. These contacts are designed to be solder-reflow compatible, and are suitable for automatic processing.

Features and Benefits
  • Sn/Cu Plated PI Film outer layer
  • Polymeric Foam Core
  • Soft SMD contacts are RoHS compliant
  • Halogen-free per IEC-61249-2-21 standard
  • Reflow tunnel compatible to 260° C

5G HandsetAutomotive
Commercial TelecomComputing
HandsetIndustrial Electronics
TabletsTelecom, 5G, Consumer, Automotive, Military

Automated PackagingCustom Automation
Custom Product DevelopmentPrototyping

Antenna ContactConducting on PCB
Grounding on PCB

Technical Specification

Compression Set<20%
Construction and CompositionMetallized PI film over Polyurethane Foam
Flame RetardancyUL94 HB
Foam Core MaterialPolyurethane
Gasket ProfileRectangular / Hourglass
Operating Temperature Max (Celsius)85
Operating Temperature Min (Celsius)-40
Parts (2)
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Part NumberPart NameCompression SetConstruction and CompositionOperating Temperature Max (Celsius)Operating Temperature Min (Celsius)
SLG<20%Metallized PI film over Polyurethane Foam85-40
SLH<20%Metallized PI film over Polyurethane Foam85-40

Company Address

Techni3 Ltd

Unit 4B Caerphilly Business Park


CF83 3GS

+44 (0)29 2125 2100

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