It weighs only about half that of polystyrene and one quarter that of polytetrafluoroethylene. FlexK LoK is waterproof and has excellent thermal characteristics, tolerating high and low temperatures. Material does not flake or shed. It s used in a variety of application from thin dielectric spacer in PCB to radome.
Features and Benefits
Low dielectric constant
Light weight and flexible
Excellent thermal insulation and stability
Automated Pad Placement
Custom Product Development
Base station/Power amplifier/Acitve antenna unit /small cell