ECCOSTOCK FFP is designed to infiltrate densely populated electronic packages, readily filling void space around components when vibrated in place. It can be used to stabilize crystal oscillators as well as other delicate components that need to be held in place or thermally and vibration protected.
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| Aerospace/Defense | Healthcare / Medical |
| Automated Pad Placement | Automated Packaging |
| Custom Automation | Custom Product Development |
| Modeling | Prototyping |
| Service | Testing |
| Medical diagnostic |
| Color | white |
| Density (g/cc) | 0.24 |
| Dielectric Constant | 1.30 |
| Dielectric strength (Kv/mm) | 2.5 |
| Function | Dielectric |
| Loss Tangent | 0.00500 |
| Operating Temperature Max (Celsius) | 175 |
| Operating Temperature Min (Celsius) | -65 |
| REACH | Yes |
| ROHS Compliant | Yes |
| Resin | Epoxy |
| Thermal Conductivity (W/mK) | 0.05 |
| Type | Low Loss Dielectric curing |
| Volume Resistivity | 3.49 x10^11 Ohm-cm |
