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CoolZorb HD500

Hybrid Thermal/EMI Absorber

Product Description

CoolZorb HD500 is a High Deflection version of the CoolZorb 500 hybrid electromagnetic absorber and thermal interface material. The product is used like a traditional thermal interface material between a heat source such as an IC and a heat sink or other heat transfer device or metal chassis. CoolZorb HD560 also functions to suppress unwanted energy coupling, resonances or surface currents which cause board level EMI issues. The high deflection property reduces mechanical stresses of the application, specifically targeting next gen high performance IC to avoid cracks or pin breaks.

Features and Benefits
  • High thermal conductivity with good EMI suppression within 20-90GHz
  • Inherent surface tack typical of standard thermal gap fillers
  • High deflection property reduces mechanical stresses of the application, specifically to avoid cracks or pin breaks
  • Meets UL 94 V-0 flame requirements
  • Dual functional properties of thermal conductivity and EMI reduction provide two in one solution for easier design and assembly and lower cost of ownership
  • Improved reliability performance of electronicsBetter signal integrity due to reduction of EMI
  • Consistent performance of electronics due to temperature stability and low outgassing properties of product
  • Improved EMC performance and resultant lower cost to meet compliance requirements
  • Environmentally friendly solution that meets regulatory requirements including RoHS and REACH

5G Data Infrastructure5G Handset
5G Peripherals5G Telecom
Automotive and Industrial ElectronicsAutonomous Vehicle
Blade serversCabinet Applications
CloudCommercial Telecom
Consumer AccessoriesConsumer Electronics
Data InfrastructureDatacom
Electric VehicleGaming
Medical EquipmentMilitary
Mobile DevicesMobile Infrastructure
Network and telecommunications equipmentNetworking
Personal Medical DevicesPrinters
Security and defenseServers
Small consumer electronicsTelecom
Telecom, 5G, Consumer, Automotive, MilitaryTelecom, Automotive, Other
Telecom, consumer and general applicationsTelecommunications
TransportationVideo graphics
Wearable electronicsWireless

Automated PackagingAutomated Pad Placement
Custom AutomationCustom Product Development

EMI AttenuationHigh Deflection
mmWaveOptical Module
Thermal Transfer

Datasheets and Documents

Technical Specification

Attenuation @10GHz (dB/cm)15.4
Attenuation @20GHz (dB/cm)34.2
Attenuation @28GHz (dB/cm)48.1
Attenuation @39GHz (dB/cm)64.5
Attenuation @77GHz (dB/cm)106.4
Density (g/cc)3.39
Hardness (Shore 00)26
Operating Temperature Max (Celsius)175
Operating Temperature Min (Celsius)-40
Outgassing CVCM (%)0.040
Outgassing TML (%)0.350
ROHS CompliantYes
Thickness Max (mm)1.50
Thickness Min (mm)1.50
UL Flammability RatingUL 94 V0 (pending)
Volume Resistivity8.80 x10^13 Ohm-cm

Company Address

Techni3 Ltd

Unit 4B Caerphilly Business Park


CF83 3GS

+44 (0)29 2125 2100

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