CoolShield-Flex is a stack-up film of thermal interface materials (TIM), metal foils and conductive pressure sensitive adhesives (CPSA). Used together with board level shielding (BLS) frame, it can perform both thermal transmission and shielding for ICs in electronics devices. Meanwhile, CoolShield-Flex provides lower total thickness comparing with other solutions, which makes it fit for use in all compact space designs such as smartphones, tablets and other consumer electronics.
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5G Data Infrastructure | 5G Handset |
5G Peripherals | 5G Telecom |
Aerospace | Blade servers |
Cabinet Applications | Cloud |
Commercial Telecom | Computing |
Consumer | Consumer Accessories |
Consumer Electronics | Data Infrastructure |
Datacom | Gaming |
General applications | Handset |
Healthcare | Healthcare / Medical |
IT | Medical |
Medical Equipment | Military |
Mobile Devices | Mobile Infrastructure |
Network and telecommunications equipment | Networking |
Personal Medical Devices | Robotics |
Satellite | Security and defense |
Servers | Small consumer electronics |
Tablets | Telecom |
Telecom, 5G, Consumer, Automotive, Military | Telecom, Automotive, Other |
Telecom, consumer and general applications | Telecommunications |
Video graphics | Wearable electronics |
Wireless |
Automated Packaging | Automated Pad Placement |
Custom Automation | Custom Product Development |
Prototyping | Service |
Testing |
EMI Shielding | Low Height Shielding |
Thermal Transfer |
Color | Copper |
Density (g/cc) | 2.50 |
Hardness (Shore 00) | 40 |
Operating Temperature Max (Celsius) | 120 |
Operating Temperature Min (Celsius) | -20 |
REACH | Yes |
ROHS Compliant | Yes |
Shielding Effectiveness @ 10GHz (dB) | 60.0 |
Shielding Effectiveness @ 1GHz (dB) | 50.0 |
UL Flammability Rating | UL 94 V0 |