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CoolShield Flex

Thermal and EMI Shielding Film

Product Description

CoolShield-Flex is a stack-up film of thermal interface materials (TIM), metal foils and conductive pressure sensitive adhesives (CPSA). Used together with board level shielding (BLS) frame, it can perform both thermal transmission and shielding for ICs in electronics devices. Meanwhile, CoolShield-Flex provides lower total thickness comparing with other solutions, which makes it fit for use in all compact space designs such as smartphones, tablets and other consumer electronics.

Features and Benefits
  • Low height
  • Low weight
  • Efficient thermal path
  • Good shielding effectiveness
  • Ease of assembly with thermal interface material applied both sides
  • Can survive reflow
  • flexible film allows for PCB component height tolerance during assembly

5G Data Infrastructure5G Handset
5G Peripherals5G Telecom
AerospaceBlade servers
Cabinet ApplicationsCloud
Commercial TelecomComputing
ConsumerConsumer Accessories
Consumer ElectronicsData Infrastructure
General applicationsHandset
HealthcareHealthcare / Medical
Medical EquipmentMilitary
Mobile DevicesMobile Infrastructure
Network and telecommunications equipmentNetworking
Personal Medical DevicesRobotics
SatelliteSecurity and defense
ServersSmall consumer electronics
Telecom, 5G, Consumer, Automotive, MilitaryTelecom, Automotive, Other
Telecom, consumer and general applicationsTelecommunications
Video graphicsWearable electronics

Automated PackagingAutomated Pad Placement
Custom AutomationCustom Product Development

EMI ShieldingLow Height Shielding
Thermal Transfer

Datasheets and Documents

Technical Specification

Density (g/cc)2.50
Hardness (Shore 00)40
Operating Temperature Max (Celsius)120
Operating Temperature Min (Celsius)-20
ROHS CompliantYes
Shielding Effectiveness @ 10GHz (dB)60.0
Shielding Effectiveness @ 1GHz (dB)50.0
UL Flammability RatingUL 94 V0
Not found.

Company Address

Techni3 Ltd

Unit 4B Caerphilly Business Park


CF83 3GS

+44 (0)29 2125 2100

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