Flectron® metallized fabric combines highly conductive metals with lightweight fabric to meet a diverse range of EMI/RFI shielding requirements. Manufactured with Laird's patented technology, Flectron metallized fabric is available in various woven and non-woven substrate configurations.
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| 5G Data Infrastructure | 5G Handset |
| 5G Telecom | Automotive |
| Commercial Telecom | Computing |
| Consumer | Electric Vehicle |
| Handset | Healthcare / Medical |
| Industrial Electronics | Printers |
| Tablets | Telecom, Automotive, Other |
| Wearable electronics |
| Automated Packaging | Custom Automation |
| Custom Product Development | Prototyping |
| Service | Testing |
| Medical equipment | Notebook computers |
| Plasma Display Panels (PDPs) | Printers |
| Set-top boxes | Telecommunications enclosure cabinets |
| Construction and Composition | Tin-Plated Copper, Copper Foil, Nickel-Copper Fabric Tape |
| Operating Temperature Max (Celsius) | 260 |
| Operating Temperature Min (Celsius) | 10 |
| Plane Wave (2GHz) | Typcially 85 dB - 95 dB |
| Single or Double Sided | NA |
| Surface Resistivity | Low surface resistivity based on material selection |
