 | Kzorb Hybrid Dielectric AbsorberHybrid Dielectric/Absorber System Kzorb is a hybrid family of products consisting of a flexible dielectric silicone layer and a flexible microwave absorbing layer. This system provides RF and microwave insulation combined with RF and microwave absorbing function. The dielectric layer provides the spacing required to minimize absorber affects at the surface level and provides electrical insulation. Show More |
 | CoolZorb 200Hybrid Thermal/EMI Absorber CoolZorb 200 is a hybrid absorber/thermal management material that is used for EMI mitigation and heat dissipation. It is used like a traditional thermal interface material between a heat source such as an IC and a heat sink or other heat transfer device or metal chassis. CoolZorb 200 also functions to suppress unwanted energy coupling, resonances or surface currents causing board level EMI issues. Show More |
| CoolZorb 400Hybrid Thermal/EMI Absorber CoolZorb 400 is a hybrid absorber/thermal management material that is used for EMI mitigation and heat dissipation. It is used like a traditional thermal interface material between a heat source, such as an IC, and a heat sink or other heat transfer device or metal chassis. CoolZorb 400 also functions to suppress unwanted energy coupling, resonances or surface currents causing board level EMI issues. Show More |
| CoolZorb 500Hybrid Thermal/EMI Absorber CoolZorb 500 is a 2nd generation hybrid absorber/thermal management material that is used for EMI mitigation. The product is used like a traditional thermal interface material between a heat source such as an IC and a heat sink or other heat transfer device or metal chassis. CoolZorb 500 also functions to suppress unwanted energy coupling, resonances or surface currents which cause board level EMI issues. Show More |
| CoolZorb 600Hybrid Thermal/EMI Absorber CoolZorb 600 is a 2nd generation hybrid absorber/thermal management material that is used for EMI mitigation. This product is used like a traditional thermal interface material between a heat source such as an IC and a heat sink or other heat transfer device or metal chassis. CoolZorb 600 also functions to suppress unwanted energy coupling, resonances or surface currents causing board level EMI issues. Show More |
| CoolZorb HD500Hybrid Thermal/EMI Absorber CoolZorb HD500 is a High Deflection version of the CoolZorb 500 hybrid electromagnetic absorber and thermal interface material. The product is used like a traditional thermal interface material between a heat source such as an IC and a heat sink or other heat transfer device or metal chassis. CoolZorb HD560 also functions to suppress unwanted energy coupling, resonances or surface currents which cause board level EMI issues. The high deflection property reduces mechanical stresses of the application, specifically targeting next gen high performance IC to avoid cracks or pin breaks. Show More |
| CoolZorb-UltraHybrid Thermal/EMI Absorber CoolZorb-Ultra series is a higher performance and silicone free hybrid absorber/thermal management material with ultra-high thermal conductivity of 11.5W/m.K. CoolZorb-Ultra is designed to be used like a traditional thermal interface material between heat source such as a high-power IC and heat sink or other heat transfer device or metal chassis. CoolZorb-Ultra also functions to suppress unwanted energy coupling, resonances or surface currents causing board level EMI issues. Show More |
 | GOF3000Hybrid Thermal/EMI Gasket Lairds electrically conductive Graphite-over-Foam, GOF3000 thermal and EMI gasket, provides thermal transfer performance in the form of a traditional wrapped compressible foam gasket, and contains an outside wrap for electrical conductivity. GOF3000 combines the thermal transfer performance of the Tgon 9000 synthetic graphite outside wrap and the repeatable compression and rebound of the foam core. GOF3000 utilizes a silicone foam core for lower compression force and UL V0 flammability rating. Show More |
 | CoolShield FlexThermal and EMI Shielding Film CoolShield-Flex is a stack-up film of thermal interface materials (TIM), metal foils and conductive pressure sensitive adhesives (CPSA). Used together with board level shielding (BLS) frame, it can perform both thermal transmission and shielding for ICs in electronics devices. Meanwhile, CoolShield-Flex provides lower total thickness comparing with other solutions, which makes it fit for use in all compact space designs such as smartphones, tablets and other consumer electronics. Show More |
| GOF1000Thermal Gasket Lairds Graphite?over?Foam (GOF), GOF1000 thermal gasket, provides thermal transfer performance in the form of a traditional wrapped compressible foam gasket. GOF1000 combines the thermal transfer performance of the Tgon 9000 synthetic graphite outside wrap and the repeatable compression and rebound of a foam core. GOF1000 utilizes a polyurethane foam. Show More |
| GOF2000Thermal Gasket Lairds Graphite?over?Foam (GOF), GOF2000 thermal gasket, provides thermal transfer performance in the form of a traditional wrapped compressible foam gasket. GOF2000 combines the thermal transfer performance of the Tgon 9000 synthetic graphite outside wrap and the repeatable compression and rebound of a foam core. GOF2000 utilizes Laird LSF series silicone foam allowing for a UL V0 flammability rating. Show More |
