A holistic technology package tackling EMI / thermal and structural challenges at once

The signature of today’s advanced technology – whether it’s autonomous vehicles, 5G enabled devices, sensors creating an internet of things, or home routers – is high-speed, high-volume data transfer in increasingly dense packages. It poses new and unprecedented challenges for design engineers worldwide.

For one, these electronics generate an even higher potential for a significant amount of electromagnetic signal interference. New products operate at higher frequencies and use more powerful ICs/SOCs to facilitate enhanced data transfer and capabilities. But EMI is only one part of the problem. More components make electronics more powerful, but also hotter, thus increasing the need for fast, reliable heat dissipation. Don't forget about increasing needs for mechanical and environmental durability, space constraints, and lightweight designs. Enclosures are not just simple aesthetic housing. They are functional, essential parts helping to address EMI and thermal challenges while protecting devices and systems from potentially harsh environments.

Design engineers face a quandary: How do I effectively mitigate EMI and transfer heat in tight (and shrinking) space?

Laird´s new Integrated Solutions Portfolio addresses these multifaceted challenges with a unique range of multifunctional products and solutions. Combining our decades long wealth of expertise in EMI products, precision metals, RF absorber and thermal solutions - with the latest material and manufacturing innovations sparked a new way of thinking and has resulted in a plethora of value-add solutions. Significantly reducing your total cost of ownership and maintaining premium performance while lowering design iteration efforts is Laird´s driver for ISE (your Integrated Solutions Engineered).

Laird ISE is your one-stop-shop: from simulations/modeling to co-engineering, co-designing and high quality manufacturing. Challenge us to trust us.