The phenomenon of electromagnetic interference (EMI) is familiar to virtually everyone, even if they do not understand the underlying principles. Most people have witnessed first-hand the effects of interference. To control EMI Government organizations, such as the FCC, CSA, and EEC, mandate that manufacturers may not design, produce, or sell electronic equipment that jams the public broadcast services. In other instances, however, EMI can constitute to more than a minor inconvenience. The military and medical communities, for example, require trouble-free operation of their electronic equipment in adverse electromagnetic environments since malfunctions could jeopardize mission, and potentially cause serious harm. The European Union’s EMC (Electromagnetic Compatibility) directive also mandates that “the apparatus has an adequate level of intrinsic immunity to electromagnetic disturbance to enable it to operate as intended”.
The trend in today’s electronic devices is faster, smaller, and digital rather than analogue. Most equipment (95%) of today contains digital circuits. Today’s digital designers must create a circuit board that has the lowest possible EMI, combined with the highest possible operating/processing speeds. Design of the printed circuit board (PCB) is the most critical EMC influencing factor for any system, since virtually all active devices are located on the circuit board. It is the changing electrical current produced by the active devices that result in EMI.
There are two approaches that can be used to reduce the emission from the circuit board. The first approach is to operate the circuit at the slowest speeds consistent with the functionality of the system, lay out the PCB with the smallest possible loop areas (especially the high speed devices), insert suppression components such as filters, ferrite beads, and bypass capacitors into the circuit to reduce its bandwidth. These techniques will result in a desired decrease in the high frequency and the circuit bandwidth, and a corresponding undesired decrease in both the operating speed and system reliability. The use of slower speeds with reduced bandwidth will help to desensitize the circuit to external magnetic susceptibility fields. The second is to use shielding. Shielding is the only non-invasive suppression technique. Since the shielding is not inserted into the circuit, it does not affect the high frequency operating speed of the system, nor does it affect the operation of the system should changes be made to the design in the future. In addition, shielding does not create timing problems and waveform distortion; it does not decrease system reliability; and it reduces crosstalk. Plus, shielding works for both emission suppression as well as susceptibility problems. Even with the overall advantages of shielding, the most cost-effective approach is to use a combination of circuit suppression/hardening and shielding.
EMI suppression isn’t easy to achieve if a gasket doesn’t fit your application’s requirements. Our fabric-over-foam gaskets are ideal for applications that require low compression force but still need high conductivity and shielding attenuation. If you’re looking to protect computer, telecommunications, or other equipment that requires soft shielding, we provide fabric-over-foam gaskets in a variety of shapes and thickness to meet your needs.
Available in nickel/copper (Ni/Cu) and tin/copper (Sn/Cu), our fabric-over-foam gaskets deliver versatile galvanic compatibility and shielding.
Laird’s SMD (Surface Mount Device) Grounding Contact is a foam cored contact with a metalized polyimide film outer covering. It is used for circuit grounding of SMT (Surface Mount Technology) devices. These contacts are designed to be solder reflow compatible and are suitable for automatic processing.
Air particles can infiltrate even the best EMI applications. But with the right components, we can help you keep your designs protected and dust-free. Laird’s Electro-Air EMI/Dust Filtration, MaxAir and Electrovent panels provide effective shielding while capturing airborne contaminants, so you can enjoy quality protection with minimal interference.
If you’re looking for a proven air filtration and EMI shielding solution, we’ve got you covered. Our vent panels consist of layered, woven and crimped wire mesh combined with filtering media to help capture nature’s elements without disrupting ventilation and airflow to your applications. Each panel features EMI gaskets designed to prevent signal migration to sensitive electronic equipment.
Managing electromagnetic interference requires protection that effectively considers space, weight and application constraints. Whether you need a one-piece, two-piece or a multi-compartmental shield, our board level shields provide isolation of board level components.
Fashioned from Laird-manufactured parts, our versatile shielding solutions provide a strong foundation for your EMI applications without compromising the quality of base materials or design. Each board level shield offers a secure cover design that’s ideal for applications subject to shock and vibration such as mobile military vehicles, commercial aircraft and wireless electronics. Available in custom shapes and mounting options, our shields will help you minimize crosstalk and interference while maintaining optimal system speed and performance.
Laird offers an extensive selection of enclosure sheilding gaskets. Engineered metal Fingerstock solutions from Laird dates from 1938. Laird specializes in designing miniatureparts of thin strip metal in quantities ranging from thousands of pieces to millions of pieces. With over 3,400 standard parts, Laird has an off-the-shelf solution that meets your application’s requirements. Contact strips are used for grounding and shielding in high-frequency equipment and for forming large diameter contact rings.A wide variety of beryllium copper contact strips provides engineers anddesigners with flexibility in solving grounding and shielding problems. Various lengths, widths, thicknesses, contours and hole locations are possible for many of the standard catalog items.
Engineered metal Fingerstock solutions from Laird dates from 1938. Laird specializes in designing miniature parts of thin strip metal in quantities ranging from thousands of pieces to millions of pieces. With over 3,400 standard parts, Laird probably already has an off-the-shelf solution that meets your application’s requirements.
When custom designs are needed, Laird engineering staff helps construct efficiencies in performance, cost and manufacturability from the very beginning stages of the application.
Laird’s standard precision electronic contacts ground, carry current and signals, and interconnect boards and devices. A wide variety of plating options allow for the maximum electrical current carrying performance. An array of designs in a standard format are ready for production. Installed costs are lower with our tape and reel.
Knitted Wire or Conductive Thread gaskets and tape for shielding and grounding of electronic and electric applications.
All Mesh EMI Gasketing has been designed to offer the highest possible levels of attenuation. Knit construction enhances long lasting resiliency, making it an ideal material for highly sensitive components in permanent or semi-permanent enclosures where environmental sealing is not a concern.
Laird’s Ecofoam™ offers an innovative approach to traditional shielding and grounding by providing X, Y and Z-axis conductivity, enhancing the shielding effectiveness required to meet the increasing microprocessor speeds of today’s computer, telecommunications and other electronic equipment. The product is offered with a conductive PSA tape on one side.
Ecofoam™ can be customized to your application by die-cutting, hole-punching, notching, and so on and is especially useful for odd-shaped applications which are difficult to shield with typical profile gaskets. Ecofoam™ is designed for low-cycling applications such as input/output (I/O) shielding and other non-shear standard connectors.
For more information, visit the product page hereLaird manufactures form-in-place gaskets using an automated system for dispensing conductive elastomers. Our resilient, form-in-place gaskets provide reliable protection for compartmentalized cast or plastic enclosures and packaged electronic assembles.
If you’re looking for EMI components that are compatible with plastic, metal and plated substrates, our form-in-place gaskets can assist. Laird manufactures standard and custom form-in-place gaskets that optimize performance for a variety of electronics including telecom antenna(Radio/RRU/AAU/AAS), automotive(Cluster/infotainment chassis sheilding/Radar/Autonomous driving system), datacom(optical transceiver/ high speed connectors).
Metal Plated Flexible Fabrics and Non-Woven Textiles
Sometimes, the standard silicone gasket just won’t do. Differing weather conditions, operating temperatures, levels of chemical exposure, corrosion, and environmental fluctuations call for gaskets that are designed to shield electromagnetic interference in environmental-specific settings. Our electrically conductive elastomers provide environmental sealing, excellent mechanical functionality, and electromagnetic shielding so your enclosures receive the best protection possible with optimal electrical performance.
Your closure problem usually starts like this: you’ve constructed an effective shielding system using a metal housing and lid. But when you combine the flat surfaces of both units, you notice a slight opening. Suddenly, gas, liquid, or high frequency electromagnetic energy have an easy-access path to your shielding system, which can worsen under high pressure and corrosion. Thankfully, our resilient, conductive elastomers can seal this opening by conforming to surface irregularities in your shield’s enclosure.
