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Tpcm FSF52

Thermal Phase Change Material

Product Description

Tpcm FSF52 is a free standing film. It contains no substrate. At temperatures greater than 52?C Tpcm FSF52 changes into a molten state and under low closure force wets the heat sink and component surfaces to create a very thin low thermal resistance interface. Tpcm FSF52 is thixotropic and won't flow from the interface. Tpcm FSF-52 has superior thermal performance comparable to the highest performing grease and phase change products available. Since it is a free standing film it is easy to handle and is a great replacement for messy grease.


Automated PackagingAutomated Pad Placement
Custom AutomationCustom Product Development

Graphic CardsHard Disk Drives
IGBTsMemory Modules
Notebooks/Tablets/Portable DevicesServers
Smart Home DevicesWireless infrastructure

Technical Specification

Density (g/cc)2.10
Dielectric Constant6.70
Minimum Bondline Thickness (microns)12
Minimum Bondline Thickness (mm)0.01
Operating Temperature Max (Celsius)125
Operating Temperature Min (Celsius)-40
Phase Change Temperature (Deg C)52
Shelf Life1 year from Date of Shipment
Thermal Conductivity (W/mK)0.90
Thermal Resistance @10 psi Max (C-in2/W)0.042
Thermal Resistance @10 psi Min (C-in2/W)0.042
Thermal Resistance @50 psi Max (C-in2/W)0.030
Thermal Resistance @50 psi Min (C-in2/W)0.030
Thickness Max (inches)0.005
Thickness Max (mm)0.13
Thickness Min (inches)0.005
Thickness Min (mm)0.13
UL Flammability RatingV-0
Volume Resistivity8.00 x10^13 Ohm-cm
Parts (2)
↑ click on headings to sort ↓
Part NumberPart NameThickness(inches)Thermal Resistance @ 10 psi(C - in2 / W)Thermal Resistance @ 50 psi(C - in2 / W)Minimum Bondline Thickness (microns)
A14691-21Tpcm FSF5205,A0 18x18in0.0050.040.0312
A14691-36Tpcm FSF5205,A0 9x9in0.0050.040.0312

Company Address

Techni3 Ltd

Unit 4B Caerphilly Business Park


CF83 3GS

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