Home - Products - Thermal Interface Materials - Phase Change - Tpcm 780SP

Tpcm 780SP

Screen Printable Phase Change Material



Product Description


Tpcm 780SP is a high performance, inherently tacky, easy to rework screen printable phase change thermal interface material. Developed specifically to meet the high thermal conductivity and low thermal resistance requirements of today'ss demanding processors. This silicone-free material is so soft that it begins to flow as the temperature is elevated by just a small amount.


Features and Benefits
  • Silicone-free for applications that are silicone sensitive Low total thermal resistance
  • Inherently tacky and easy to use, no adhesive required
  • High thermal reliability
  • Ease of use for high volume manufacturing
  • No mess due to thixotropic characteristics which prevent flow outside of interface

Industries
ConsumerTelecom/Datacom

Capabilities
Automated PackagingAutomated Pad Placement
Custom AutomationCustom Product Development
ModelingPrototyping
ServiceTesting

Applications
Graphic CardsHard Disk Drives
IGBTsMemory Modules
Notebooks/Tablets/Portable DevicesServers
Smart Home DevicesWireless infrastructure

Technical Specification

ColorGrey
Density (g/cc)2.50
Minimum Bondline Thickness (microns)25
Minimum Bondline Thickness (mm)0.03
Operating Temperature Max (Celsius)125
Operating Temperature Min (Celsius)-40
Outgassing CVCM (%)0.200
Outgassing TML (%)0.510
Phase Change Temperature (Deg C)45
Shelf Life1 year from Date of Shipment
Thermal Conductivity (W/mK)5.40
UL Flammability RatingV-0
Parts (3)
↑ click on headings to sort ↓
Part NumberPart NameMinimum Bondline Thickness (microns)
A16001-00Tpcm 780SP 1kg,Can,1quart25
A16001-01Tpcm 780SP 1/2kg,Can,1pint25
A16001-02Tpcm 780SP 20kg,5Gal Pail,25

Company Address

Techni3 Ltd

Unit 4B Caerphilly Business Park

Caerphilly

CF83 3GS


Privacy Policy