Used where electrical isolation is not required, Tgon 800 is ideal for where electrical contact and thermal transfer are desired. Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the XY plane and 5 W/mK through the z-axis. Tgon 800 can be supplied in 12 x 18 (305mm x 457mm) or 18 x 24 (457mm x 610mm) sheets, rolls or die-cut to specific configurations. It is also available with proprietary pressure sensitive adhesive on one side. This adhesive coating is the thinnest available, minimizing any impact on thermal performance.
Features and Benefits
High thermal conductivity of 5 W/mK in Z axis and 240 W/mK in the X-Y axis