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Soft HB-SMD Foam Contact

Soft HB-SMD Foam Contact Solutions



Product Description


Laird’s SMD (Surface Mount Device) Grounding Contact is a foam-cored contact with a metalized polyimide film outer covering. It is used for circuit grounding of SMT (Surface Mount Technology) devices. These contacts are designed to be solder-reflow compatible, and are suitable for automatic processing.


Features and Benefits
  • Sn/Cu Plated PI Film outer layer
  • Polymeric Foam Core
  • Soft SMD contacts are RoHS compliant
  • Halogen-free per IEC-61249-2-21 standard
  • Reflow tunnel compatible to 260° C

Industries
5G HandsetAutomotive
Commercial TelecomComputing
ConsumerGaming
HandsetIndustrial Electronics
TabletsTelecom, 5G, Consumer, Automotive, Military

Capabilities
Automated PackagingCustom Automation
Custom Product DevelopmentPrototyping
ServiceTesting

Applications
Antenna ContactConducting on PCB
Grounding on PCB

Technical Specification

Compression Set<20%
Construction and CompositionMetallized PI film over Polyurethane Foam
Flame RetardancyUL94 HB
Foam Core MaterialPolyurethane
Gasket ProfileRectangular / Hourglass
Operating Temperature Max (Celsius)85
Operating Temperature Min (Celsius)-40
Parts (2)
↑ click on headings to sort ↓
Part NumberPart NameCompression SetConstruction and CompositionOperating Temperature Max (Celsius)Operating Temperature Min (Celsius)
SLG<20%Metallized PI film over Polyurethane Foam85-40
SLH<20%Metallized PI film over Polyurethane Foam85-40

Company Address

Techni3 Ltd

Unit 4B Caerphilly Business Park

Caerphilly

CF83 3GS


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