Lairds Ecofoam offers an innovative approach to traditional shielding and grounding by providing X, Y and Z-axis conductivity, enhancing the shielding effectiveness required to meet the increasing microprocessor speeds of todays computer, telecommunications and other electronic equipment. The product is offered with a conductive PSA tape on one side. Ecofoam can be customized to your application by die-cutting, hole-punching, notching, and so on and is especially useful for odd-shaped applications which are difficult to shield with typical profile gaskets. Ecofoam is designed for low-cycling applications such as input/output (I/O) shielding and other non-shear standard connectors.
Features and Benefits
Halogen-free per IEC-61249-2-21 standard
Excellent z-axis conductivity to provide effective EMI shielding and grounding
Low compression forces allow for use of lighter materials