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Eccostock FFP

One part cure in place low loss dielectric



Product Description


ECCOSTOCK FFP is designed to infiltrate densely populated electronic packages, readily filling void space around components when vibrated in place. It can be used to stabilize crystal oscillators as well as other delicate components that need to be held in place or thermally and vibration protected.


Features and Benefits
  • Light weight
  • Low shrinkage
  • Thermal insulation
  • one part curing system
  • Low loss dielectric

Industries
Aerospace/DefenseHealthcare / Medical

Capabilities
Automated Pad PlacementAutomated Packaging
Custom AutomationCustom Product Development
ModelingPrototyping
ServiceTesting

Applications
Medical diagnostic

Technical Specification

Colorwhite
Density (g/cc)0.24
Dielectric Constant1.30
Dielectric strength (Kv/mm)2.5
FunctionDielectric
Loss Tangent0.00500
Operating Temperature Max (Celsius)175
Operating Temperature Min (Celsius)-65
REACHYes
ROHS CompliantYes
ResinEpoxy
Thermal Conductivity (W/mK)0.05
TypeLow Loss Dielectric curing
Volume Resistivity3.49 x10^11 Ohm-cm
Documents



Company Address

Techni3 Ltd

Unit 4B Caerphilly Business Park

Caerphilly

CF83 3GS


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