Learn how to beat the heat at “Thermal Management 101”

December 5, 2018, 12:01 pm

Join Laird Staff Scientist Kaley Cancar for insights on the growing array of thermal compliance issues now facing electronic systems designers.  

Providing enough cooling power is only a first step.  An ever-worsening challenge is transferring growing heat loads from hot components into heat sinks and other cooling hardware.  

In this recorded event, Kaley will trace the  evolution of high-performance thermal interface materials (TIMs) and share steps electronic manufacturers are taking to create precision-designed TIMs.