Solutions: Phase Change


Tpcm 780SP



Screen Printable Phase Change Material

Tpcm 780SP is a high performance, inherently tacky, easy to rework screen printable phase change thermal interface material. Developed specifically to meet the high thermal conductivity and low thermal resistance requirements of today'ss demanding processors. This silicone-free material is so soft that it begins to flow as the temperature is elevated by just a small amount.

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Tpcm 200SP



Screen Printable Phase Change Material

TpcmTM 200SP is a silicone free, thermal phase change material (PCM) designed to meet the thermal reliability and outgassing requirements of LED lighting applications, while offering a low total cost of ownership. It is specifically designed for use in various optical applications such as automotive headlamps, LED lighting, cameras, lasers and sensors. TpcmTM 200SP is also well suited for the broader market where the thermal requirements are moderately demanding. Tpcm 200SP is a screen printable phase change material which quickly dries to the touch so that it can be pre-applied to components for future assembly.

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Tpcm 580SP



Screen Printable Phase Change Material

TpcmTM 580SP is an exceptionally high performance, screen printable or stencilable thermal interface material designed to meet the thermal reliability and price requirements of high-end thermal applications. It contains a solvent to assist in processing. After drying off the solvent, Tpcm 580SP will be dry to the touch. Tpcm 580SP begins to soften and flow at temperatures around 50deg C. At which point, Tpcm 580SP will fill the microscopic irregularities of the components it contacts. The result is an interface with minimal contact thermal resistance. Tpcm 580SP softens; it does not fully change state, resulting in minimal migration (pump out) under thermal cycling from room temperature to chip device operating temperatures.

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Tmate 2900



Thermal Phase Change Material

For Exceptionally Low Thermal Resistance The Tmate 2900 Series is a reusable phase change material (PCM) designed for ease of testing and rework ability. It has a composite construction of a special malleable metal alloy and a high-performance PCM. At 50deg C the Tmate 2900 Series begins to soften and flow filling the microscopic irregularities of the thermal solution thus reducing thermal resistance. It shows no thermal performance degradation after 1 000 hours @130deg C or after 500 cycles from -25deg C to 125deg C. The PCM softens and does not fully change state resulting in minimal migration (pump-out) at operating temperatures (see viscosity curve). It is available in three thicknesses: 0.005""; (0.125 mm) 0.010""; (0.25 mm) and 0.020""; (0.5 mm).

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Tpcm 580



Thermal Phase Change Material

For Exceptionally Low Thermal Resistance The Tpcm 580 Series is a high-performance thermal phase change material (PCM) designed to meet the thermal reliability and price requirements of high-end thermal applications. The Series is inherently tacky, flexible and exceptionally easy-to-use. The Tpcm 580 Series is available in four thicknesses: 0.003""; (Tpcm 583), 0.005""; (Tpcm 585), 0.008""; (Tpcm 588), 0.010""; (Tpcm 5810) and 0.016""; (Tpcm 5816). At temperatures above its transition temperature of 50deg C (122deg F), the Tpcm 580 Series begins to soften and flow, filling the microscopic irregularities of the components it comes into contact with. The result is an interface with minimal thermal contact resistance. Due to the gradual change in viscosity (softening), it minimizes migration (pump-out). The Tpcm 580 Series can be supplied as cut parts in strips and rolls with top tabbed liners for easy application. The top tabbed liner can be removed immediately or provide a protective cover during shipping, and can be removed at assembly. It can also be supplied in sheets and custom die-cut configurations; and meets all environmental requirements including RoHS.

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Tpcm HP105



Thermal Phase Change Material

For Exceptionally Low Thermal Resistance The Tpcm™ HP105 Series is a high-performance phase change material (PCM) product with exceptionally low thermal resistance. It has a softening range of approximately 50deg C to 60deg C. Proprietary technology prevents excessive pump-out after the initial heat cycle. The material is naturally tacky and requires no adhesive coating or heat sink preheat for attachment. The Tpcm HP105 Series does not cure and can be easily removed without pulling the processor out of the socket. It is supplied in rolls with a top tabbed liner for easy manual or large volume automated applications.

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Tpcm 780



Thermal Phase Change Material

Tpcm 780 is a high performance, inherently tacky, easy to rework phase change thermal interface material. Developed specifically to meet the high thermal conductivity and low thermal resistance requirements of today’s demanding processors. This silicone-free material is so soft that it begins to flow as the temperature is elevated by just a small amount. Also, since no tabs are required, Tpcm 780 eliminates the need for expensive converting.

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Tpcm 900



Thermal Phase Change Material

Tpcm 900 is a high performance, non-electrically conductive phase change material. At 50deg C, Tpcm 900 begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the component's surfaces, thereby reducing thermal resistance. Tpcm 900 is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance. Tpcm 900 shows no thermal performance degradation after 1,000 hours @130deg C, or after 500 cycles, from -25deg C to 125deg C. The material softens and does not fully change state resulting in minimal migration (pump out) at operating temperatures (see viscosity curve). Tpcm 900 is supplied in rolls with top tabbed liners for easy manual or large volume automatic application. Individually die cut parts can also be supplied.

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Tpcm AL52



Thermal Phase Change Material

Tpcm AL52 is a thermally conductive phase change material coated on both sides of aluminum foil. At temperatures greater than 52C, Tpcm AL52 changes into a molten state and, under low closure force, wets the heat sink and component surfaces to create a very thin, low thermal resistance interface. Tpcm AL52 has great heat spreading characteristics and won’t flow from the interface. Tpcm AL52 has superior thermal performance comparable to the highest performing grease and phase change products available. Since it is a free standing film it is easy to handle and is a great replacement for messy grease. Tpcm AL52 is available as individual die cut parts, kiss cut parts on rolls or sheets, and uncut rolls. Tpcm AL52 is available with or without adhesive.

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Tpcm FSF52



Thermal Phase Change Material

Tpcm FSF52 is a free standing film. It contains no substrate. At temperatures greater than 52?C Tpcm FSF52 changes into a molten state and under low closure force wets the heat sink and component surfaces to create a very thin low thermal resistance interface. Tpcm FSF52 is thixotropic and won't flow from the interface. Tpcm FSF-52 has superior thermal performance comparable to the highest performing grease and phase change products available. Since it is a free standing film it is easy to handle and is a great replacement for messy grease.

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Tpcm 750



Thermal Phase Change Material

TpcmTM 750 Series is a high-performance thermal phase change material designed to meet the thermal reliability and price requirements of high-end thermal applications. The series is inherently tacky, flexible and extremely easy-to-use. The TpcmTM 750 series is available in 0.2 mm (Tpcm 758) and 0.25 mm (Tpcm 7510) thicknesses. At temperatures above its transition temperature of 50°C, the TpcmTM 750 series begins to soften and flow, filling the microscopic irregularities of the components it comes into contact . The result is minimal thermal contact resistance at the interfaces. The Tpcm 750 Series can be supplied as cut parts with tabbed liners for easy application.

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