Automotive Component Sector

TPutty

For two decades, Laird materials science experts have helped Tier 1 automotive suppliers resolve complex electronics design challenges where the structure of the module meets EMI suppression and heat channelling. We are designers helping designers avoid wasted effort – and costs - and speeding the time-to-market for key components.

Review our portfolio of protection solutions. Then contact us today.

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Superior Protection From a Global Innovator in Material Science


EV Powertrain Electronics

Our team of engineers applies extensive industry knowledge about sub-assembly design to help safeguard EV powertrain electronics from heat and EMI issues.

Examples include PFC chokes and transformers, which by their nature are not perfectly efficient and generate heat. Each must be housed individually – and thermally potted.

We get behind the wheel to help with two differentiators. First, we are vertically integrated down to the magnetic ceramic powder. Second, as a significant thermal compounds supplier we are again vertically integrated down to the resins and fillers.

These differentiators help give us the green light to assume responsibility for performance and quality assurance across a much larger swath of the supply chain than our competitors.



1. Low Profile SMD DCDC Power Inductor 2. TGREASE 2500 Thermally Conductive Grease 3. Broadband Wire Mound Common Mode Choke 4. TFLEX CR200 Cure-In-Place Gap Filler
  • Lowest cost design goal
  • Maximum shielding
  • Down to 1.88mm part height
  • For space-conscious designs
  • 3.8 W/mK thermal conductivity
  • Environmentally friendly; silicone free
  • Thoroughly wets out thermal surfaces
  • No migration issues
  • Nanocrystalline core
  • Enables higher switching mode designs
  • High power/high efficiency apps
  • 2.0 W/mK thermal conductivity
  • 2-part silicone base
  • Low viscosity
  • Ideal for large gap tolerances

LED Component Systems

Our team of engineers applies extensive industry knowledge about sub-assembly design to help suppress EMI crosstalk from automotive LED systems. And to help better safeguard against excessive heat.

Modern lighting systems are comprised of a power supply, a digital control board, and a light source – all ideally physically separated from each other. The pressure to reduce size frequently results in placing the analog, digital, and optical functions close together and not electrically isolated. This can create electrical crosstalk and can expose the optics to processing chemicals needed for the analog and digital circuits.

We have a complete line of non-silicone and low outgassing silicone-based pads, greases and dispensable products. Most importantly, we have the experience to advise you about deploying a variety of strategies. Our multi-functional solutions help cool components and suppress EMI simultaneously - using a single space-saving product.



1. Beam Shading Stamped Metal 2. TFLEX SF8800 Gap Filler 3. TPUTTY 607 One-Part Dispensable Gap Filler 4. EMI Low Current Magnetic Ceramic Chip Beads
  • Beam shading and steering
  • Rapid prototyping
  • Long term performance simulation
  • *NAL patent pending
  • 8.0 W/mK conductivity
  • Superior pressure vs. deflection
  • Low total thermal resistancethermal resistanceresistance
  • Excellent surface wetting
  • 6.4 W/mK thermal conductivity
  • Vertical reliability
  • Low outgassing
  • For PCB apps/lidar
  • Superior noise suppression
  • Currents up to 10A; low DCR
  • Vibration resistant
  • Small footprint

ADAS / Autonomous Driving Systems

Our team of engineers applies extensive industry knowledge about sub-assembly design to help safeguard ADAS electronic components from EMI and excessive heat.

Progressive ADAS sensor designs consume more power and emit more heat. To remain competitive, manufacturers must ensure optimum sensor efficiency or face the risk of throttled power, in turn sacrificing sensitivity, range and performance.

Electromagnetic interference (EMI) is a barrier to function and compliance. Increasing transistor switching speeds cause various device fundamentals and harmonics to interact with each other, and the outside world, in unanticipated ways.



1. Q-ZORB Thermoset Microwave Absorber 2. TGREASE 2500 3. TPUTTY 607 One-Part Dispensable Gap Filler 4. SSMD Electronic Contact
  • Nomex™ or fiberglass honeycomb core
  • Optimize insertion loss
  • Optimize reflection loss
  • For radar/radar brackets
  • 3.8 W/mK thermal conductivity
  • Silicone free thermal grease
  • Ends migration issues
  • Environmentally friendly
  • 6.4 W/mK thermal conductivity
  • Vertical reliability
  • Low outgassing
  • For PCB apps/lidar
  • Board/device interconnections
  • Nickel, tin, gold, silver platings
  • 0.13mm thickness

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EV/PHEV Battery Packs

Our team of engineers applies extensive industry knowledge about sub-assembly design to help safeguard EV/PHEV battery packs from the consequences of excessive heat.

With increased charging speeds, battery packs emit ever increasing amounts of heat. Are packs actively or passively cooled? Must the thermal material act as a dielectric barrier? Is the pack silicone- or non-silicone mandated? Are the thermal materials themselves relied upon for mechanical support or for high compliance?

Ultimately, the appropriate choice of thermal interface materials satisfies the design constraints while simultaneously satisfying the economics. It comes after extensive evaluation of the total cost of ownership and true cost of implementation in a serial production setting. Huge material volumes are required. The importance of fast placement of preferred materials cainterface materials satisfies the design constraints while simultaneously satisfying the economics. It comes after extensive evaluation of the total cost of ownership and true cost of implementation in a serial production setting. Huge material volumes are required. The importance of fast placement of preferred materials cannot be overstated.



1. TPUTTY 607 One-Part Dispensable Gap Filler 2. TFLEX SF600 Thermally Conductive Gap Pad 3. TFLEX CR200 Cure-In-Place Gap Filler 4. TFLEX 400 HD Thermal Pad
  • 6.4 W/mK thermal conductivity
  • Vertical reliability
  • Low outgassing
  • For PCB apps/lidar
  • 3.0 W/mK conductivity
  • Silicone-free for sensitive apps
  • 0.25mm to 3.56mm thickness
  • RoHS compliant
  • 2.0 W/mK thermal conductivity
  • 2-part silicone base
  • Low viscosity
  • Ideal for large gap tolerances
  • 40 W/mK conductivity
  • High deflection gap filler
  • 1mm to 4mm thicknesses
  • Excellent surface wetting

Infotainment/Cluster Systems

Our team of engineers applies extensive industry knowledge of mechanical, thermal and electronic design to help safeguard infotainment/cluster systems from heat and EMI issues.

Infotainment electronics are employing greater functionality and higher speeds, causing more pronounced EMI and thermal challenges. A passive cooling strategy is imperative to eliminate the fan without relinquishing any gains in the power budget.

Following 20 years of experience in infotainment electronics, Laird has a first-hand perspective on strategies that have succeeded and failed. We consult with our customers comprehensively on ridding systems of unwanted EMI and growing thermal loads, and on helping design teams succeed as they go-to-market



1. Fabric-Over-Foam Gasket 2. MGV Power Inductor 3. EMI Low Current Magnetic Ceramic Chip Bead 4. TPUTTY 607 Single Part Dispensable Gap Filler
  • Plated, conductive fabrics/foams
  • EMI shielding effectivenesshielding effectiveness > 100dB
  • Low surface resistivityresistivity
  • RoHS compliant, Halogen free
  • Lowest cost design goal
  • Magnetic shielded
  • High current/low profile
  • Low DCR/high efficiency
  • Superior noise suppression
  • Currents up to 10A; low DCR
  • Vibration resistant
  • Small footprint
  • Low stress on components
  • Designs for low cost
  • Maximum thermal transfer
  • PCB apps